PAC TECH PACKAGING TECHNOLOGIES GMBH
D 14641 NAUEN - Allemagne
Tel.: +49 (0) 3321 - 4495 - 0
Fax: +49 (0) 3321 - 4495 110
E-mail: info@pactech.de
Website: www.patech.de
M. Thorsten Dr. TEUTSCH
(CEO)
Contact commercial :
M. Wrike SCHMIDT
(Chargé des Relations Publiques)
Skills:
Advanced Packaging Equipment and Water Level Packaging Services :
- Laser solder jetting without thermal or mechanical stress (HDD, camera modules...)
- Laser bonding & assembly (Flip - Chip, 2.5D & 3D Packaging)
- Automatic electroless plating system for waters, silicon & Glass Interposers
- Laser solder jetting without thermal or mechanical stress (HDD, camera modules...)
- Laser bonding & assembly (Flip - Chip, 2.5D & 3D Packaging)
- Automatic electroless plating system for waters, silicon & Glass Interposers
Activities:
- Very high precision micromechanical engineering
- Jet micromachining: water, sand, etc.
- Electroplating
- Designing, development and integrated production engineering of micromechanical and/or microelectrical microsystems for :
- aerospace
- arms
- audio and/or video
- automotive
- Automatic assembly machines
- Equipment for workstation environment