2018 exhibitor profile
Next trade fair catalogue online in July 2020
Back to list


PAC TECH
PACKAGING TECHNOLOGIES GMBH

C - allée 6 / 611
Am Schlangenhorst 7 – 9
D 14641 NAUEN - Allemagne
Tel.: +49 (0) 3321 - 4495 - 0
Fax: +49 (0) 3321 - 4495 110
E-mail: info@pactech.de
Website: www.patech.de

Responsable de l'entreprise :
M. Thorsten Dr. TEUTSCH
(CEO)

Contact commercial :
M. Wrike SCHMIDT
(Chargé des Relations Publiques)

Skills

Advanced Packaging Equipment and Water Level Packaging Services :

- Laser solder jetting without thermal or mechanical stress (HDD, camera modules...)

- Laser bonding & assembly (Flip - Chip, 2.5D & 3D Packaging)

- Automatic electroless plating system for waters, silicon & Glass Interposers

Advanced Packaging Equipment and Water Level Packaging Services :

- Laser solder jetting without thermal or mechanical stress (HDD, camera modules...)

- Laser bonding & assembly (Flip - Chip, 2.5D & 3D Packaging)

- Automatic electroless plating system for waters, silicon & Glass Interposers

Activities

- Very high precision micromechanical engineering
- Jet micromachining: water, sand, etc.
- Electroplating
- Designing, development and integrated production engineering of micromechanical and/or microelectrical microsystems for :
     - aerospace
     - arms
     - audio and/or video
     - automotive
- Automatic assembly machines
- Equipment for workstation environment

ADDITIONAL PAGES
2018 EXHIBITORS
MUCH MORE
THAN A TRADE FAIR
Zoom on a market or an innovative
business sector, conferences,
"Microns & Nano d’Or" contest
Microtechnological links